Redux® and HexBond™ Film Adhesives, Foaming Films, Primers and Liquid Shims
Hexcel formulates and manufactures a comprehensive range of structural film adhesives, foaming adhesive films, paste adhesives, liquid shims and primers for aerospace and industrial markets.
Redux® and HexBond™ Film Adhesives
Epoxy and bismaleimide (BMI) adhesives are supplied in film form on a roll and require heat and pressure to cure. These high performance structural adhesives are ideal for metal to metal and composite bonding and for the manufacture of honeycomb sandwich structures.
Redux® and HexBond™ Foaming Adhesive Films
When cured at elevated temperature these films expand, making them ideal for gap filling, honeycomb core edge bonding and core splicing. Redux® and HexBond™ foaming adhesive films are supplied in sheet form and are designed to be used in conjunction with Redux® Film Adhesives.
Each Redux® primer has been formulated to ensure the maximum possible performance is achieved from the corresponding Redux® and HexBond™ film adhesive. Redux® primers protect pretreated metal surfaces prior to bonding and ensure maximum bond durability. All Redux® primers are free of chromium compounds.
Redux® and HexBond™ Shimming Adhesives
These are two-part epoxy adhesives which can be cured either at room temperature or elevated temperature to achieve higher levels of mechanical performance.
HexBond™ Paste Adhesives
A range of one and two component epoxy and BMI adhesives which can be used for bonding, potting, and filling composite and metallic structures. These products are supplied in a variety of different package forms including cartridges and small containers.